I really don't know what they meant about the 470uF cap. So perhaps lay out the board with a place for one, and you can then populate or not depending on whatever?

For the pads, one alternative is to have "plated through-hole" pads, which can then be soldered from underneath. The PCATS memory upgrades used this technique. Requires a double-sided board, and plated holes also cost more.

Others here may have more ideas and knowledge about this. Anyone?